HF& MIXED

Short Description:

The product in the picture on the left Application: Consumer Electronics Board Model:TU836+ Layers/Thickness(mm): 14L/2.0 Measurement(mm*mm):190*222 Line Width/Line Space(mm): 0.09/0.10 Min hole's size(mm):0.1 Surface Finished: ENIG


Product Details

Features

High frequency PCB boards are special circuit boards with higher electromagnetic frequencies. Generally speaking, high-frequency can be defined as frequencies above 1GHz. Its various physical properties, accuracy, and technical parameters require very high requirements, and are often used in automotive anti-collision systems, satellite systems, radio systems and other fields.
With the rapid development of science and technology, more and more equipment designs are applied in the microwave frequency band (>1GHZ) and even in the millimeter wave field (30GHZ), which also means that the frequency is getting higher and higher, and the requirements for the circuit board are getting higher and higher. For example, the substrate material needs to have excellent electrical properties, good chemical stability, and the loss on the substrate with the increase of the power signal frequency is very small, so the importance of the high-frequency PCB board is highlighted.

ITEM HF& MIXED
Maxium Layers 20
Finished Thickness(mm) 6
Dielectric Thickness(mm) 0.025
Material HF PTFE、HF Hydrocarbon
Heat Conductivity /
Dielectric Constant  
Copper Substrate
Thickness
Inner Copper Thickness max:12oz
Outer Copper Thickness max:14oz
Minimum Drilling Diameter Blind (mm) 0.15
buried via (mm) 0.15
Through (mm) 0.15
Hole Tolerance PTH ±0.04
(mm)
NPTH ±0.025
(mm)
Thickness To Diameter Ratio Of Resin Plug Hole 12:01
Minimum Diameter of SM Plug Hole (mm) 0.2
Thickness To Diameter Ratio Of SM Plug Hole 10:01
Impedance Tolerance ±10%
Minimum Line Diameter/Line Distance
(Inner Layber)μm
50/50
Minimum Line Diameter/Line Distance
(Outer Layer)μm
50/50
Minimun BGA Bonding Pad(mm) 0.225
Minimum BGA Center Spacing (mm) 0.35
Maximum Size Of Combination (mm) 600*500
Stiffener Bonding Precision \
Surface Technics ENIG,HASL,Immersion Silver/Tin, OSP、ENEPIG、Soft/Hard Gold Plating、Selection、Carbon Ink、Peelable Blue Mask
Special Technics Mechanical Blind Via,HF,FR-4 Composite Laminate

 

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