| ITEM | FPC | |
| Maxium Layers | 24 | |
| Finished Thickness（mm） | 0.05-3mm | |
| Dielectric Thickness（mm） | 0.025 | |
| Material | PI/PET | |
| Heat Conductivity | / | |
| Dielectric Constant | / | |
| Copper Substrate Thickness |
Inner Copper Thickness | min: Hoz max: 3oz |
| Outer Copper Thickness | min:0.33oz max:3oz |
|
| Minimum Drilling Diameter | Blind (mm) | 0.05 |
| buried via (mm) | 0.05 | |
| Through (mm) | 0.1 | |
| Hole Tolerance | PTH | ±0.05 |
| (mm) | ||
| NPTH | ±0.025 | |
| (mm) | ||
| Thickness To Diameter Ratio Of Resin Plug Hole | 12:01 | |
| Minimum Diameter of SM Plug Hole (mm) | 0.2 | |
| Thickness To Diameter Ratio Of SM Plug Hole | 10:01 | |
| Impedance Tolerance | ±10% | |
| Minimum Line Diameter/Line Distance （Inner Layber）μm |
50/50 | |
| Minimum Line Diameter/Line Distance （Outer Layer）μm |
50/50 | |
| Minimun BGA Bonding Pad(mm) | 0.15 | |
| Minimum BGA Center Spacing (mm) | 0.35 | |
| Maximum Size Of Combination (mm) | 800*800 | |
| Stiffener Bonding Precision | ±0.075 | |
| Surface Technics | OSP、ENIG、OSP+ENIG（optional）、 LF HAL、ENEPIG、Gold Plating | |
| Special Technics | RF HDI | |
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