Flexible circuit boards, due to their thinness, lightness and flexibility, have become the basic components of a large number of electronic products and are widely used in smart terminals, wearable electronics, consumer electronics, automobiles, medical care, industrial control and other fields. With the miniaturization and multi-functionality of electronic products, flexible circuit boards are evolving towards refinement and multi-layering.
FPC flexible circuit boards account for a large proportion of applications in smart phones, which can meet the needs of mobile phone screens, batteries, and camera modules. In the 5G era, the emergence of multifunctional smart phone modules, radio frequency modules, folding screens, and miniaturized models are inseparable from the connection of FPC flexible circuit boards. Therefore, in the development of smart phones, the amount of FPC flexible circuit boards is also constantly improving.
With the development trend of miniaturization of smart terminals, FPC flexible circuit boards are light and flexible, making them more and more important during manufacturing of smart wearable devices. As one of the main materials of smart wearable devices, FPC flexible circuit boards have a broad market development space. It is expected to continue to rise in the future and become a beneficiary of the development of smart wearable devices.
In addition to consumer electronic products, the application of FPC flexible circuit boards also covers many fields such as automobiles, medical treatment, and industrial control, and the application prospects are very broad.
ITEM | FPC | |
Maxium Layers | 24 | |
Finished Thickness(mm) | 0.05-3mm | |
Dielectric Thickness(mm) | 0.025 | |
Material | PI/PET | |
Heat Conductivity | / | |
Dielectric Constant | / | |
Copper Substrate Thickness |
Inner Copper Thickness | min: Hoz max: 3oz |
Outer Copper Thickness | min:0.33oz max:3oz |
|
Minimum Drilling Diameter | Blind (mm) | 0.05 |
buried via (mm) | 0.05 | |
Through (mm) | 0.1 | |
Hole Tolerance | PTH | ±0.05 |
(mm) | ||
NPTH | ±0.025 | |
(mm) | ||
Thickness To Diameter Ratio Of Resin Plug Hole | 12:01 | |
Minimum Diameter of SM Plug Hole (mm) | 0.2 | |
Thickness To Diameter Ratio Of SM Plug Hole | 10:01 | |
Impedance Tolerance | ±10% | |
Minimum Line Diameter/Line Distance (Inner Layber)μm |
50/50 | |
Minimum Line Diameter/Line Distance (Outer Layer)μm |
50/50 | |
Minimun BGA Bonding Pad(mm) | 0.15 | |
Minimum BGA Center Spacing (mm) | 0.35 | |
Maximum Size Of Combination (mm) | 800*800 | |
Stiffener Bonding Precision | ±0.075 | |
Surface Technics | OSP、ENIG、OSP+ENIG(optional)、 LF HAL、ENEPIG、Gold Plating | |
Special Technics | RF HDI |