The metal substrate is composed of three parts: the circuit layer (copper foil), the insulating medium layer and the metal base plate. Among them, the metal substrate serves as the base plate, with an insulating medium layer attached to its surface. Together with the copper foil on top of the substrate, they form a conductive circuit. It has the characteristics of good heat dissipation and excellent mechanical processing performance. Currently, the most widely used are aluminum substrates and copper substrates.
The aluminum pcb board is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided aluminum PCB is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer. Very few applications are multi-layer boards, which can be formed by bonding ordinary multi-layer boards with insulating layers and aluminum bases.
The base material of the metal substrate is a metal material with a relatively high thermal conductivity. The thermal conductivity of the aluminum substrate is 0.7-3w/m.k. The thermal conductivity of copper substrates is 300-400 W /m.k, and they are mainly used in automotive headlights, taillights, and unmanned aerial vehicles. However, copper is expensive, has a high cost, and poor insulation.
The dielectric constant and dielectric loss of metal substrates are also relatively low, and they have good electrical performance in high-frequency circuits. The dielectric constant of copper substrates is 3.0-6.0, and the dielectric loss is 0.01- 0.03. The dielectric constant of aluminum substrates is 2.5- 6.0, and the dielectric loss is 0.01- 0.04.
Metal substrates have relatively high mechanical strength. Electronic products have good heat dissipation and electromagnetic shielding properties during operation. The mechanical strength of copper substrates is 600-800Mpa, and that of aluminum substrates is 200Mpa-300Mpa.
| ITEM | Metal Substrate | |
| Maxium Layers | 12 | |
| Finished Thickness（mm） | 6 | |
| Dielectric Thickness（mm） | 0.025 | |
| Material | Copper/Aluminum Substrate | |
| Heat Conductivity | 8W | |
| Dielectric Constant | ||
| Copper Substrate Thickness |
Inner Copper Thickness | max：12oz |
| Outer Copper Thickness | max：14oz | |
| Minimum Drilling Diameter | Blind (mm) | 0.15 |
| buried via (mm) | 0.15 | |
| Through (mm) | 0.15 | |
| Hole Tolerance | PTH | ±0.04 |
| (mm) | ||
| NPTH | ±0.025 | |
| (mm) | ||
| Thickness To Diameter Ratio Of Resin Plug Hole | 12:01 | |
| Minimum Diameter of SM Plug Hole (mm) | 0.2 | |
| Thickness To Diameter Ratio Of SM Plug Hole | 10:01 | |
| Impedance Tolerance | ±10% | |
| Minimum Line Diameter/Line Distance （Inner Layber）μm |
50/50 | |
| Minimum Line Diameter/Line Distance （Outer Layer）μm |
50/50 | |
| Minimun BGA Bonding Pad(mm) | 0.225 | |
| Minimum BGA Center Spacing (mm) | 0.35 | |
| Maximum Size Of Combination (mm) | 1200*1000 | |
| Stiffener Bonding Precision | \ | |
| Surface Technics | ENIG、HASL、Immersion silver/Tin、OSP、ENEPIG、Soft/Hard Gold Plating、Selection、Carbon Ink、Peelable Blue Mask | |
| Special Technics | Mechanical Blind Via, FR-4,Metal Base Material Composite Laminate | |
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