| ITEM | Metal Substrate | |
| Maxium Layers | 12 | |
| Finished Thickness（mm） | 6 | |
| Dielectric Thickness（mm） | 0.025 | |
| Material | Copper/Aluminum Substrate | |
| Heat Conductivity | 8W | |
| Dielectric Constant | ||
| Copper Substrate Thickness |
Inner Copper Thickness | max：12oz |
| Outer Copper Thickness | max：14oz | |
| Minimum Drilling Diameter | Blind (mm) | 0.15 |
| buried via (mm) | 0.15 | |
| Through (mm) | 0.15 | |
| Hole Tolerance | PTH | ±0.04 |
| (mm) | ||
| NPTH | ±0.025 | |
| (mm) | ||
| Thickness To Diameter Ratio Of Resin Plug Hole | 12:01 | |
| Minimum Diameter of SM Plug Hole (mm) | 0.2 | |
| Thickness To Diameter Ratio Of SM Plug Hole | 10:01 | |
| Impedance Tolerance | ±10% | |
| Minimum Line Diameter/Line Distance （Inner Layber）μm |
50/50 | |
| Minimum Line Diameter/Line Distance （Outer Layer）μm |
50/50 | |
| Minimun BGA Bonding Pad(mm) | 0.225 | |
| Minimum BGA Center Spacing (mm) | 0.35 | |
| Maximum Size Of Combination (mm) | 1200*1000 | |
| Stiffener Bonding Precision | \ | |
| Surface Technics | ENIG、HASL、Immersion silver/Tin、OSP、ENEPIG、Soft/Hard Gold Plating、Selection、Carbon Ink、Peelable Blue Mask | |
| Special Technics | Mechanical Blind Via, FR-4,Metal Base Material Composite Laminate | |
UIC is a professional manufacturer of EMS service for global customers, providing one-stop service from product design,PCB fabrication, raw&auxiliary materials procurement,PCBA manufacturing and finished product assembly.
