| ITEM | HDI | |
| Maxium Layers | 16 | |
| Finished Thickness（mm） | 3 | |
| Dielectric Thickness（mm） | 0.025 | |
| Material | Normal FR4、High-speed | |
| Heat Conductivity | / | |
| Dielectric Constant | / | |
| Copper Substrate Thickness |
Inner Copper Thickness | min: Hoz max: 2oz |
| Outer Copper Thickness | min:0.33oz max:2oz | |
| Minimum Drilling Diameter | Blind (mm) | 0.06 |
| buried via (mm) | 0.1 | |
| Through (mm) | 0.1 | |
| Hole Tolerance | PTH | ±0.05 |
| (mm) | ||
| NPTH | ±0.025 | |
| (mm) | ||
| Thickness To Diameter Ratio Of Resin Plug Hole | 16:01 | |
| Minimum Diameter of SM Plug Hole (mm) | 0.15 | |
| Thickness To Diameter Ratio Of SM Plug Hole | 10:01 | |
| Impedance Tolerance | ±7% | |
| Minimum Line Diameter/Line Distance （Inner Layber）μm |
45/45 | |
| Minimum Line Diameter/Line Distance （Outer Layer）μm |
45/50 | |
| Minimun BGA Bonding Pad(mm) | 0.15 | |
| Minimum BGA Center Spacing (mm) | 0.3 | |
| Maximum Size Of Combination (mm) | 400*280 | |
| Stiffener Bonding Precision | \ | |
| Surface Technics | OSP、ENIG、OSP+ENIG（optional）、 LF HAL、ENEPIG、Gold Plating | |
| Special Technics | Side Wall Metallization、Half-Hole、Countersink、 Depth-Drilling、 POFV | |
UIC is a professional manufacturer of EMS service for global customers, providing one-stop service from product design,PCB fabrication, raw&auxiliary materials procurement,PCBA manufacturing and finished product assembly.
