High Density Interconnect (HDI) refers to the high-density interconnect technology using the blind/buried via holes to enhance the density of circuit distributions on a PCB. The advantage is, the HID can significantly increase the availability of PCB space for maximum product miniaturization. However, as circuits are densely distributed, vias cannot be drilled by traditional drilling methods, and some vias (blind) must be made by laser drilling, while buried vias must be made for interconnect.
| ITEM | HDI | |
| Maxium Layers | 16 | |
| Finished Thickness（mm） | 3 | |
| Dielectric Thickness（mm） | 0.025 | |
| Material | Normal FR4、High-speed | |
| Heat Conductivity | / | |
| Dielectric Constant | / | |
| Copper Substrate Thickness |
Inner Copper Thickness | min: Hoz max: 2oz |
| Outer Copper Thickness | min:0.33oz max:2oz | |
| Minimum Drilling Diameter | Blind (mm) | 0.06 |
| buried via (mm) | 0.1 | |
| Through (mm) | 0.1 | |
| Hole Tolerance | PTH | ±0.05 |
| (mm) | ||
| NPTH | ±0.025 | |
| (mm) | ||
| Thickness To Diameter Ratio Of Resin Plug Hole | 16:01 | |
| Minimum Diameter of SM Plug Hole (mm) | 0.15 | |
| Thickness To Diameter Ratio Of SM Plug Hole | 10:01 | |
| Impedance Tolerance | ±7% | |
| Minimum Line Diameter/Line Distance （Inner Layber）μm |
45/45 | |
| Minimum Line Diameter/Line Distance （Outer Layer）μm |
45/50 | |
| Minimun BGA Bonding Pad(mm) | 0.15 | |
| Minimum BGA Center Spacing (mm) | 0.3 | |
| Maximum Size Of Combination (mm) | 400*280 | |
| Stiffener Bonding Precision | \ | |
| Surface Technics | OSP、ENIG、OSP+ENIG（optional）、 LF HAL、ENEPIG、Gold Plating | |
| Special Technics | Side Wall Metallization、Half-Hole、Countersink、 Depth-Drilling、 POFV | |
UIC is a professional manufacturer of EMS service for global customers, providing one-stop service from product design,PCB fabrication, raw&auxiliary materials procurement,PCBA manufacturing and finished product assembly.
