FR4 board is a code name for the grade of flame-retardant material. It represents a material specification that the resin material must be able to extinguish by itself after burning. It is not a material name, but a material grade. Therefore, there are many types of FR-4 grade materials used for pcb, but most of them are composite materials made of so-called Tera-Function epoxy resin, Filler and glass fiber.
FR-4 PCB board, according to different uses, industry insider generally call them: FR-4 Epoxy Glass Cloth, insulating board, epoxy board, epoxy resin board, brominated epoxy resin board, FR-4 , Fiberglass board, fiberglass board, FR-4 reinforcement board, FPC reinforcement board, flexible circuit board reinforcement board, FR-4 epoxy resin board, flame-retardant insulation board, FR-4 laminated board, epoxy board , FR-4 light board, FR-4 fiberglass board, epoxy glass cloth board, epoxy glass cloth laminate, circuit board drilling pad.
Main technical features and applications of FR-4 board: stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance standards, suitable for high-performance electronic insulation requirements products, such as FPC reinforcement board, PCB drilling pad, glass fiber meson, potentiometer carbon film printed glass fiber board, precision star gear (wafer grinding), precision test plate, electrical (electrical) equipment insulation support spacer, insulation backing plate, transformer insulation plate, motor insulation, grinding gear, electronic switch insulation board, etc.
| ITEM | FR-4 | |
| Maxium Layers | 38 | |
| Finished Thickness（mm） | 9 | |
| Dielectric Thickness（mm） | 0.025 | |
| Material | Normal FR4、High-speed | |
| Heat Conductivity | / | |
| Dielectric Constant | / | |
| Copper Substrate Thickness |
Inner Copper Thickness | max：12oz |
| Outer Copper Thickness | max：14oz | |
| Minimum Drilling Diameter | Blind (mm) | 0.15 |
| buried via (mm) | 0.15 | |
| Through (mm) | 0.15 | |
| Hole Tolerance | PTH | ±0.04 |
| (mm) | ||
| NPTH | ±0.025 | |
| (mm) | ||
| Thickness To Diameter Ratio Of Resin Plug Hole | 12:01 | |
| Minimum Diameter of SM Plug Hole (mm) | 0.2 | |
| Thickness To Diameter Ratio Of SM Plug Hole | 10:01 | |
| Impedance Tolerance | ±10% | |
| Minimum Line Diameter/Line Distance （Inner Layber）μm |
50/50 | |
| Minimum Line Diameter/Line Distance （Outer Layer）μm |
50/50 | |
| Minimun BGA Bonding Pad(mm) | 0.225 | |
| Minimum BGA Center Spacing (mm) | 0.35 | |
| Maximum Size Of Combination (mm) | 1200*1000 | |
| Stiffener Bonding Precision | \ | |
| Surface Technics | ENIG、HASL、Immersion Silver/ Tin、OSP、ENEPIG、 Soft/Hard Gold Plating、Selection、Carbon Ink、
Peelable Blue Mask |
|
| Special Technics | Step Slot、Embedded、POFV、Mechanical BVH、Side Wall Metallization、Half-Hole、HD-HS-Mixed Pressure、Bending、Embedded Resistor | |
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