The structure is composed of HDMI interface module, VGA interface module, FPGA control module, DDR2 data storage module, key module and display driver module.Its characteristics are: The image data is received and processed by HDMI interface module or VGA interface module, and the FPGA control module and DDR2 data storage module are connected to the received image data for image processing and data storage. The FPGA control module is controlled by the key module to display the image by the display driver module in different display modes.
High-end euipment-high speed Pick and Place Machines that can process about 40,000 SMD components per hour.
High efficient supply ability 80K Square Meters monthly-Offers low volume and on-demand PCB production, also large-scale productions.
Professional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III Standards.
We provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.
Item | Performance |
PCBA Size | 800mm*600mm |
PCBA Thickness | 8mm |
Size of SMT Parts | 01005-100*90*25mm |
IC Pitch | 0.3mm |
BGA/CSP | 0.3mm |
PCBA Complexity | Double-sided patch,dispensing,DIP,pressure welding,radiator |
Nitrogen reflow/ Wave/Vapor Phase Soldering | Yes |
Technology | Lead Free |
BGA checking | 3D |
BGA rework | Yes(ERSA BGA rework station,Maximum BGA 120*150mm) |
Conformal Coating | Yes(Automatic spraying line) |
ICT | Yes(R&D of Software and hardware) |
FCT | Yes(R&D of Software and hardware) |
Assembly | Yes |
Package | Yes |
HASA | Yes(-100-200 Degrees Cycle) |
Aging | Yes(70土5Degrees) |
Board Split | Laser splitting,Mechanical Splitting |