A large number of electronic components and integrated circuits are integrated to make the control system more compact and efficient.Design and manufacturing need to take into account a variety of harsh working environments, such as high temperature, low temperature, high humidity, strong magnetic field, and so need to have a high degree of reliability and stability.Manufacturing and application need to consider cost effectiveness, so in the design and manufacturing process need to balance performance and price, to achieve high cost performance.
High-end euipment-high speed Pick and Place Machines that can process about 40,000 SMD components per hour.
High efficient supply ability 80K Square Meters monthly-Offers low volume and on-demand PCB production, also large-scale productions.
Professional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III Standards.
We provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.
Item | Performance |
PCBA Size | 800mm*600mm |
PCBA Thickness | 8mm |
Size of SMT Parts | 01005-100*90*25mm |
IC Pitch | 0.3mm |
BGA/CSP | 0.3mm |
PCBA Complexity | Double-sided patch,dispensing,DIP,pressure welding,radiator |
Nitrogen reflow/ Wave/Vapor Phase Soldering | Yes |
Technology | Lead Free |
BGA checking | 3D |
BGA rework | Yes(ERSA BGA rework station,Maximum BGA 120*150mm) |
Conformal Coating | Yes(Automatic spraying line) |
ICT | Yes(R&D of Software and hardware) |
FCT | Yes(R&D of Software and hardware) |
Assembly | Yes |
Package | Yes |
HASA | Yes(-100-200 Degrees Cycle) |
Aging | Yes(70土5Degrees) |
Board Split | Laser splitting,Mechanical Splitting |